he interconnections are made during -------Question 4Answera.photolithographyb.emitter diffusionc.metallization
Question
he interconnections are made during -------Question 4Answera.photolithographyb.emitter diffusionc.metallization
Solution
The interconnections are made during c. metallization.
In the process of creating an integrated circuit, metallization is the final stage where the components of the semiconductor device are interconnected by metal wires. This is done by depositing a thin layer of metal (like aluminum or copper) onto the semiconductor device and then using a process called photolithography to etch away the unwanted metal, leaving behind the desired interconnections.
Similar Questions
Which of the following steps are part of the photolithography process in chip manufacturing? Application of photoresist Wafer cleaningEtching Doping Ion implantation
What are the main components and processes used in photolithography, and how do they contribute to the overall process?
fter epitaxial growth the next step for IC fabrication is..?Question 5Answera.emitter diffusionb.Base diffusionc.isolation diffusion
1. What are the basic principles of photolithography and how do they work?
Metallization is used to _______1 pointDeposit high quality layer of desired materialRemoving metalCreate interconnects, contacts and other conductive pathsNone of the options are correct
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